The iPhone Face ID BGA Reballing Stencil is an essential tool for professional mobile repair technicians. It is engineered for accurate reballing and repair of Face ID related ICs and modules, ensuring precise solder ball placement and reliable repair results.

Key Features:

• Premium quality stainless steel construction.
• High precision laser-cut holes for perfect alignment.
• Designed for iPhone Face ID IC reballing.
• Suitable for Dot Projector, Flood Illuminator and Face ID related components.
• Heat resistant and reusable.
• Thin and durable design.
• Ideal for professional repair shops and technicians.
• Provides accurate solder ball positioning.
• Compatible with BGA rework stations and hot air stations.
• Long service life with corrosion-resistant material.