The OV-6 BGA Reballing Stencil is a high-quality stainless steel stencil designed for accurate mobile IC, CPU, eMMC, and UFS chip reballing. It offers precise hole alignment, excellent durability, and consistent performance, making it an ideal choice for professional mobile repair technicians.
The OV-6 BGA Reballing Stencil is manufactured from premium-grade stainless steel to provide high precision during BGA reballing and chip repair. It helps technicians restore damaged solder balls quickly and accurately, reducing repair time while improving success rates.
