High-quality Relife RL-400 solder paste (20 g) with a 183 °C melting point. Perfect for precise PCB, BGA, and mobile electronics soldering with minimal residue and strong bonding.
Relife RL-400 Solder Paste is a professional-grade soldering paste designed for electronic repair and assembly. With a medium melting temperature of 183 °C, this 20 g solder paste made from Sn63/Pb37 alloy ensures reliable solder joints with excellent wettability and low residue. It’s ideal for PCB surface mount soldering, BGA rework, and high-precision components on mobile devices and other electronics.
Key Features:
✔ Melting point: 183 °C – ideal for controlled soldering.
✔ Alloy: Sn63/Pb37 for balanced flow and strength.
✔ High viscosity and fine granule size (20–38 µm) for precision application.
✔ Minimal residue and easier cleanup.
✔ Suitable for mobile repair, PCB, and BGA applications.
✔ Environment-friendly packaging materials.
Applications:
Ideal for electronics repair centers, PCB assembly shops, and technicians needing consistent solder flow and secure bonding in sensitive components.
