SAM-10 Stencil is a high-precision BGA reballing stencil specially designed for Samsung motherboard IC repair. Manufactured from premium stainless steel, it provides accurate ball alignment, high heat resistance, and long-lasting performance for professional mobile repair technicians.
The SAM-10 BGA Reballing Stencil is an essential tool for repairing Samsung smartphone motherboards. It enables accurate reballing of BGA ICs such as CPU, eMMC, UFS, PMIC, and other chipset components. Built from durable stainless steel, the stencil resists deformation under high temperatures and ensures consistent solder ball placement.
