MT-1 Stencil is a high-quality precision BGA reballing stencil designed for mobile phone IC repair. It provides accurate solder ball alignment for professional motherboard repair, ensuring reliable and efficient IC reballing.
The MT-1 Stencil is manufactured using premium stainless steel with laser-cut precision for perfect alignment during BGA IC reballing. It is ideal for repairing mobile phone motherboards and replacing damaged ICs. Suitable for technicians and professional repair centers, this stencil offers excellent durability and consistent performance.
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