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MT-6835V BGA Reballing Stencil for Mobile IC Repair

₹180 ₹ 200 10%
Availability: In Stock

MT-6835V Stencil is a premium-quality BGA reballing stencil designed for accurate IC reballing and professional mobile motherboard repair. Made from durable stainless steel, it offers precise alignment, excellent heat resistance, and long-lasting performance.

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Categories: Mobile Repair Tools
SKU code:MT-6835V
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No 1 Brand Mobile Tools
Product Description -:

MT-6835V BGA Reballing Stencil – Precision Mobile Repair Tool

The MT-6835V Stencil is engineered for technicians who require high-precision IC reballing during smartphone motherboard repairs. Manufactured using premium stainless steel with precision laser-cut openings, it ensures accurate solder ball placement and consistent repair results.

Ideal for repairing CPU, eMMC, UFS, PMIC, and other BGA IC chips, the MT-6835V stencil is suitable for both professional repair centers and advanced mobile technicians.

Features:

  • Premium stainless steel construction
  • Precision laser-cut hole pattern
  • Accurate solder ball alignment
  • Excellent heat and corrosion resistance
  • Reusable and durable design
  • Easy to clean after use
  • Lightweight and easy to handle
  • Professional-grade BGA reballing stencil
  • Improves repair accuracy and efficiency
  • Ideal for mobile motherboard and IC repair

 

 

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