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SAM-1 BGA Reballing Stencil for Samsung IC Repair

₹180 ₹ 200 10%
Availability: In Stock

SAM-1 BGA Reballing Stencil is a high-precision stainless steel stencil specially designed for Samsung motherboard IC reballing and chip repair. It provides accurate solder ball alignment for professional mobile repair technicians and service centers.

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Categories: Mobile Repair Tools
SKU code:SAM-1
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No 1 Brand Mobile Tools
Product Description -:

The SAM-1 Stencil is manufactured from premium-quality stainless steel to ensure precise alignment and long-lasting durability. It is ideal for reballing Samsung CPU, eMMC, UFS, PMIC, and other BGA ICs commonly used in Samsung smartphones.

Key Features:

  • High-precision laser-cut holes for perfect solder ball placement.
  • Premium stainless steel construction.
  • Heat-resistant and anti-deformation design.
  • Suitable for Samsung motherboard BGA IC repair.
  • Reusable and durable for long-term professional use.
  • Compatible with most BGA reballing stations and heating platforms.
  • Ideal for mobile repair technicians, training institutes, and service centers.
  • Lightweight and easy to use.

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