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IP13 / 13 Pro / 13 Pro Max BGA Reballing Stencil

₹180 ₹ 200 10%
Availability: In Stock

IP13 / 13 Pro / 13 Pro Max BGA Reballing Stencil is a high-precision stainless steel stencil specially designed for professional mobile repair technicians. It provides accurate solder ball alignment for CPU, NAND, and IC reballing, making iPhone motherboard repairs faster, easier, and more reliable.

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Categories: Mobile Repair Tools
SKU code:ip 13/13 pro max
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No 1 Brand Mobile Tools
Product Description -:

Upgrade your mobile repair work with the IP13 / 13 Pro / 13 Pro Max BGA Reballing Stencil. Manufactured from premium stainless steel, this stencil ensures precise alignment and consistent solder ball placement for professional BGA reballing.

Features:

  • Compatible with iPhone 13, iPhone 13 Pro & iPhone 13 Pro Max
  • High-quality stainless steel construction
  • Precision laser-cut holes for accurate solder ball placement
  • Heat-resistant and anti-deformation design
  • Suitable for CPU, NAND Flash, PMIC & other IC reballing
  • Reusable and durable for long-term professional use
  • Ideal for mobile repair shops and technicians
  • Helps improve repair accuracy and efficiency

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