FONEKONG 138 PPD Solder Paste is a premium low-temperature solder paste with a 138°C melting point, specially designed for mobile phone motherboard repair, BGA reballing, SMD soldering, PCB repair, and precision electronic work. It offers excellent solder flow, strong joints, minimal residue, and reliable performance.
The FONEKONG 138 PPD Solder Paste is engineered for professional mobile repairing technicians and electronics engineers. Its low melting temperature of 138°C minimizes heat damage to delicate PCB components while providing smooth soldering performance and durable solder joints.
