The MAK-6 Stencil is a premium-quality BGA reballing stencil designed for accurate CPU and IC solder ball rework. Made from durable stainless steel, it provides precise alignment, excellent heat resistance, and long-lasting performance, making it ideal for professional mobile repair technicians.
The MAK-6 Stencil is specially designed for mobile phone CPU and IC reballing applications. Manufactured from high-grade stainless steel, it ensures accurate solder ball placement and consistent repair results. Its precision-cut design makes BGA reballing faster, easier, and more reliable for technicians.
