he USMG-4 BGA Reballing Stencil is a premium-quality stainless steel stencil designed for accurate and reliable mobile IC reballing. It provides precise solder ball alignment, making it an ideal choice for repairing CPU, eMMC, UFS, and other BGA ICs. Suitable for professional mobile repair technicians and service centers.
The USMG-4 BGA Reballing Stencil is manufactured using high-grade stainless steel to ensure long-lasting durability and excellent heat resistance. It delivers accurate solder ball positioning for efficient BGA reballing, reducing repair time while improving repair quality.
