The OV-3 BGA Reballing Stencil is a high-quality stainless steel stencil designed for precise BGA IC reballing. It is ideal for repairing CPU, eMMC, UFS, and other mobile motherboard ICs. Built for accuracy and durability, this reusable stencil is perfect for professional mobile repair technicians.
The OV-3 BGA Reballing Stencil is manufactured using premium-grade stainless steel to deliver accurate solder ball alignment during BGA reballing. It offers excellent heat resistance and long-lasting performance, making it suitable for everyday use in mobile repair workshops.
