PM-1 Stencil is a premium-quality BGA reballing stencil designed for accurate CPU and IC reballing in professional mobile phone repair. Made from durable stainless steel, it provides precise alignment, high heat resistance, and long-lasting performance for consistent repair results.
The PM-1 BGA Reballing Stencil is an essential tool for mobile repair technicians who perform CPU and IC reballing. Manufactured with high-quality stainless steel, this stencil ensures accurate solder ball placement and excellent durability during repeated heating cycles.
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