Fonekong PPD FKGL42 148°C Solder Paste (42g) is a high-performance, low-temperature solder paste designed for mobile phone, BGA, and CPU repair. It ensures smooth soldering, strong adhesion, and minimal residue, making it ideal for professional technicians.
Brand: Fonekong
Model: PPD FKGL42
Net Weight: 42g
Melting Point: 148°C (Low-Temperature Type)
Application: Perfect for mobile phones, laptops, and BGA chip soldering.
Features:
Low melting point for heat-sensitive components
Excellent wetting and adhesion properties
Smooth and uniform soldering performance
Reduces oxidation and improves solder joint reliability
Ideal for precision soldering and rework applications
Usage:
Apply a small amount to the area to be soldered and heat gently until solder flows. Suitable for reballing, chip replacement, and micro-soldering tasks.
