MAK-1 BGA Reballing Stencil is a high-quality precision stencil designed for accurate BGA IC reballing. Manufactured from durable stainless steel, it ensures precise solder ball alignment, making it an ideal choice for professional mobile phone repair technicians.
he MAK-1 BGA Reballing Stencil is engineered for professional mobile repair applications. Its precision laser-cut holes provide accurate solder ball placement, allowing technicians to perform reliable CPU, eMMC, UFS, and other BGA IC reballing tasks with ease.
