The MECHANIC iMax 9 20-in-1 Blade Set is a professional mobile phone repair tool designed for removing adhesive and glue around CPU, IC, NAND and BGA chips. It features multiple ultra-thin blades and a metal handle for precision scraping, chip repair and motherboard rework applications.
The MECHANIC iMax 9 20-in-1 CPU IC Glue Removal Blade Set is designed for professional mobile phone technicians and electronics repair specialists. It helps remove adhesive residue around delicate motherboard components and supports precision work during CPU and IC repair.
20-in-1 Blade Set: Includes multiple blade shapes for different glue removal and scraping applications.
Precision Glue Removal: Suitable for removing adhesive around CPU, IC, NAND and BGA chips.
Ultra-Thin Blades: Designed to access narrow spaces during motherboard repair.
Metal Handle: Features a metal handle designed for controlled blade handling.
Durable Material: Blades are designed for toughness, wear resistance and heat resistance.
Comfortable Grip: The handle design supports better control during detailed repair work.
Professional Application: Ideal for mobile phone repair shops and electronics technicians
