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MT-6877V BGA Reballing Stencil for Mobile IC Repair

₹180 ₹ 200 10%
Availability: In Stock

MT-6877V Stencil is a premium-quality BGA reballing stencil designed for precise IC reballing and smartphone motherboard repair. Made from high-grade stainless steel, it offers excellent durability, heat resistance, and accurate solder ball alignment for professional repair work.

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Categories: Mobile Repair Tools
SKU code:MT-6877V
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No 1 Brand Mobile Tools
Product Description -:

The MT-6877V Stencil is an essential tool for mobile repair technicians performing BGA IC reballing. Built with precision laser-cut technology, it provides accurate solder ball positioning, helping improve repair quality and reduce rework.

Its premium stainless steel construction ensures long service life, resistance to heat, and repeated usability. Suitable for reballing CPU, eMMC, UFS, PMIC, and other BGA IC chips used in modern smartphones.

Features:

  • Premium stainless steel material
  • Precision laser-cut hole design
  • Accurate solder ball alignment
  • High heat and corrosion resistance
  • Durable and reusable construction
  • Easy to clean and maintain
  • Lightweight and easy to operate
  • Suitable for professional mobile repair technicians
  • Compatible with CPU, eMMC, UFS, PMIC, and other BGA ICs
  • Ideal for smartphone motherboard repair and IC rework

 

 

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