The OV-1 BGA Reballing Stencil is designed for high-precision mobile motherboard repair and BGA IC reballing. Made from durable stainless steel, it ensures accurate solder ball positioning for consistent repair results.

Features:

• Premium quality stainless steel construction
• High precision laser-cut holes for accurate alignment
• Suitable for mobile BGA IC reballing and chip repair
• Heat-resistant and corrosion-resistant material
• Reusable and long-lasting performance
• Lightweight and convenient for daily repair work
• Ideal for professional mobile repair technicians and service centers
• Delivers reliable and consistent reballing results
• Easy to clean after use
• Lightweight and convenient for daily repair work
• Ideal for professional mobile repair technicians and service centers
• Delivers reliable and consistent reballing results