SAM E-8535P Samsung BGA Reballing Stencil is a high-quality stainless steel stencil designed for accurate reballing of Samsung CPU, UFS, eMMC and other BGA ICs. It provides precise alignment, excellent durability and is ideal for professional mobile repair technicians.
The SAM E-8535P Samsung BGA Reballing Stencil is manufactured from premium-grade stainless steel to ensure precise and reliable BGA reballing. It is specially designed for Samsung motherboard repair and delivers accurate solder ball placement for CPU, UFS, eMMC and compatible ICs.
Key Features:
