PM-2 Stencil is a professional-grade BGA reballing stencil designed for accurate CPU and IC reballing in mobile phone repairs. Made from premium stainless steel, it offers precise alignment, excellent heat resistance, and long-lasting durability for reliable repair performance.
PM-2 Stencil is a professional-grade BGA reballing stencil designed for accurate CPU and IC reballing in mobile phone repairs. Made from premium stainless steel, it offers precise alignment, excellent heat resistance, and long-lasting durability for reliable repair performance.
