The SAM-13 Samsung BGA Reballing Stencil is a premium-quality stainless steel stencil designed for precise reballing of Samsung CPU, UFS, eMMC, PMIC, and other BGA ICs. It offers accurate alignment, excellent durability, and consistent performance, making it an ideal choice for professional mobile repair technicians.
The SAM-13 Samsung BGA Reballing Stencil is specially designed to provide high-precision BGA reballing for Samsung motherboard ICs. Manufactured from premium stainless steel, it ensures long-lasting performance, excellent heat resistance, and perfect solder ball alignment.
Suitable for advanced motherboard repairing, this stencil helps technicians perform accurate CPU, UFS, eMMC, PMIC, and other Samsung IC reballing with ease.
