2UUL PH11 HOT-BLOCK Preheater for PCB Delamination & Motherboard Rebonding

₹2850 ₹ 3000 5%
Availability: In Stock

The 2UUL PH11 HOT-BLOCK Preheater is a professional PCB preheating station designed for mobile phone motherboard repair. Featuring 240W rapid heating, 40°C–245°C adjustable temperature, and uniform heat distribution, it is ideal for PCB delamination, motherboard rebonding, CPU glue removal, and BGA rework. Its compact design and adjustable PCB clamps make it an essential tool for professional mobile repair technicians.

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Categories: Mobile Repair Tools
SKU code:2UUL PH11 HOT-BLOCK Preheater
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No 1 Brand Mobile Tools

Product Description -:

2UUL PH11 HOT-BLOCK Preheater for Professional Mobile Repair

The 2UUL PH11 HOT-BLOCK Preheater is engineered to provide stable and even heating for smartphone motherboard repairs. Unlike traditional hot air heating, it distributes heat uniformly across the PCB, reducing thermal stress and increasing repair success during motherboard separation and rebonding.

Perfect for professional repair shops, service centers, and chip-level technicians, the PH11 improves efficiency while protecting sensitive motherboard components.

Key Features

  • High-power 240W heating element for rapid temperature rise
  • Adjustable temperature range from 40°C to 245°C
  • Uniform heating minimizes PCB warping and thermal damage
  • Digital temperature display for precise control
    • Adjustable PCB holding clips fit different motherboard sizes
    • Ideal for motherboard delamination and rebonding
    • Excellent for CPU, NAND, Baseband IC and BGA repair
    • Helps soften underfill glue before IC removal
    • Compact and space-saving design
    • Heat-resistant body for improved operator safety
    • Suitable for iPhone and Android motherboard repairs
    • Stable performance for professional repair workshops