The 2UUL PH11 HOT-BLOCK Preheater is a professional PCB preheating station designed for mobile phone motherboard repair. Featuring 240W rapid heating, 40°C–245°C adjustable temperature, and uniform heat distribution, it is ideal for PCB delamination, motherboard rebonding, CPU glue removal, and BGA rework. Its compact design and adjustable PCB clamps make it an essential tool for professional mobile repair technicians.
The 2UUL PH11 HOT-BLOCK Preheater is engineered to provide stable and even heating for smartphone motherboard repairs. Unlike traditional hot air heating, it distributes heat uniformly across the PCB, reducing thermal stress and increasing repair success during motherboard separation and rebonding.
Perfect for professional repair shops, service centers, and chip-level technicians, the PH11 improves efficiency while protecting sensitive motherboard components.