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SU-1 BGA Reballing Stencil for Mobile IC Repair

₹180 ₹ 200 10%
Availability: In Stock

SU-1 BGA Reballing Stencil is a high-precision stainless steel stencil specially designed for accurate BGA IC reballing and mobile motherboard repair. It provides perfect solder ball alignment, high durability, and excellent heat resistance, making it an ideal tool for professional mobile repair technicians.

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Categories: Mobile Repair Tools
SKU code:SU-1
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No 1 Brand Mobile Tools
Product Description -:

The SU-1 BGA Reballing Stencil is manufactured from premium-grade stainless steel to deliver precise solder ball positioning for BGA IC repair. It is suitable for repairing and reballing various mobile motherboard chips with professional accuracy.

Key Features:

  • Premium quality stainless steel construction
  • High precision laser-cut hole design
  • Accurate BGA IC reballing performance
  • Heat-resistant and anti-deformation material
  • Long-lasting and reusable
  • Smooth surface for easy solder paste application
  • Suitable for professional mobile repair technicians
  • Lightweight, compact, and easy to carry
  • Ideal for chip-level motherboard repairing
  • Compatible with most hot air and soldering repair stations

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