The USMG-3 Universal BGA Reballing Stencil is a premium stainless steel stencil designed for accurate reballing of mobile ICs including CPU, UFS, eMMC, PMIC, and other BGA chips. It provides precise alignment, excellent heat resistance, and long-lasting performance, making it an ideal choice for professional mobile repair technicians.
The USMG-3 Universal BGA Reballing Stencil is manufactured from high-quality stainless steel to ensure precise solder ball placement and reliable IC reballing. It is suitable for repairing various smartphone motherboard ICs with professional accuracy.
