The WSR-1 CPU Reballing Stencil is a high-quality precision stencil designed for accurate BGA CPU reballing and IC repair. Made from durable stainless steel, it offers precise alignment, excellent heat resistance, and long-lasting performance, making it an essential tool for professional mobile repair technicians.
The WSR-1 Stencil is specially engineered for precise CPU and IC reballing in smartphone motherboard repairs. Manufactured from premium stainless steel, it ensures accurate solder ball placement, helping technicians achieve reliable and professional repair results.
