The 2UUL BH15 Heat Insulation Pad (Glass Storing Base) is a premium heat-resistant silicone pad designed for mobile phone repairing, BGA reballing, CPU/IC soldering, and precision chip work. Its magnetic design securely holds stencils and small components, while the high-temperature resistant silicone surface protects delicate parts during repair.

Key Features

• Premium heat-resistant silicone construction.
• Withstands temperatures up to 500°C.
• Strong magnetic surface for securely holding BGA stencils and chips.
• Ideal for CPU, IC, NAND Flash, BGA, and PCB repair.
• Non-slip surface for improved precision.
• Soft silicone protects delicate components from scratches.
• Excellent heat dissipation design for better cooling during reballing.
• Easy to clean and resistant to solder residue.
• Compact and lightweight for professional repair work.
• Suitable for mobile repair shops and electronics technicians.