JITONGXUE T4 PRO Professional Chips Glue Removal & Reballing Platform designed for CPU, eMMC, and RAM chip repair. Ideal for precise chip positioning, glue removal, and BGA reballing work.
The JITONGXUE T4 PRO Chips Glue Removal & Reballing Platform is a professional-grade tool designed for advanced mobile phone motherboard repair. It is specially developed for CPU, eMMC, and RAM chip glue removal and precision reballing.
This platform ensures accurate chip positioning and stable support during BGA rework operations. It helps technicians safely remove underfill glue and perform clean, precise solder ball reballing.
Perfect for professional repair technicians working on Android motherboards, iPhone boards, and advanced chip-level repairs.
Professional glue removal and chip reballing platform
Designed for CPU, eMMC, and RAM chips
Stable chip positioning system
Supports precision BGA reballing work
High accuracy alignment for safe repair
Durable and professional repair-grade build
Includes 3D planting mesh (as mentioned on box)
Ideal for advanced motherboard repair labs
✔ CPU chip repair
✔ eMMC reballing
✔ RAM chip rework
✔ Mobile motherboard repair
✔ Chip-level technicians
✔ Professional repair centers
